Jafar Saniie

  • Chair of the Department of Electrical and Computer Engineering
  • Filmer Chair Professor of Electrical and Computer Engineering

Education

Ph.D., EE, Purdue University, 1981
M.S., BME, Case Western Reserve University,1977
B.S.E.E. (with High Honors), University of Maryland, 1974

Research Interests

Professor Jafar Saniie joined the Department of Electrical and Computer Engineering at Illinois Institute of Technology in 1983 where he is currently the Department Chair, the Filmer Endowed Chair Professor, and Director of Embedded Computing and Signal Processing (ECASP) Research Laboratory (http://ecasp.ece.iit.edu/). He received his B.S. degree with high honors in Electrical Engineering from the University of Maryland in 1974. He received his M.S. degree in Biomedical Engineering in 1977 from Case Western Reserve University, Cleveland, Ohio, and his Ph.D. degree in Electrical Engineering in 1981 from Purdue University, West Lafayette, Indiana. In 1981, Dr. Saniie joined the Department of Applied Physics, University of Helsinki, Finland, to conduct research in photothermal and photoacoustic imaging.

Saniie’s research interests and activities are in ultrasonic signal and image processing, ultrasonic software-defined communication, artificial intelligence and machine learning, statistical pattern recognition, estimation and detection, data compression, time-frequency analysis, embedded digital systems, system-on-chip hardware/software co-design, Internet of Things, computer vision, and deep learning, and ultrasonic nondestructive testing and imaging. Over the years, his research has been funded by NSF, ONR, DoD, EPRI, University of Chicago, and Argonne National Laboratory.

He has supervised 35 Ph.D. dissertations, and 22 M.S. theses to completion. Saniie has over 350 publications in technical journals, conference proceedings, book chapters, and technical reports. He has been the research advisor to students who received Bendix Award (1986); the IEEE Region 4 Best Paper Award (1986); IEEE Ultrasonics Symposium Best Student Paper Award (2006, 2013, 2019); IEEE EIT Conference Best Student Paper Award (2017, 2019); Rath Endowed Research Award for Ph.D. Students (2019); Sigma Xi/IIT Student Research Award (2020); Department of Energy – Nuclear Energy (DoE-NE) Integrated University Program Graduate Fellowship (2020); ECE Best Ph.D. Paper Competition (2007, 2008); and ECE Day Ph.D., M.S., and Undergraduate Poster Competition Award (2018, 2019). Dr. Saniie received the 2007 University (Illinois Institute of Technology) Excellence in Teaching Award and received the 2006 ECE Outstanding Faculty Award for Excellence and Contributions to Electrical and Computer Engineering Programs.

Saniie is an IEEE Life Fellow for contributions to ultrasonic signal processing for detection, estimation, and imaging. He has been a Technical Program Committee member of the IEEE Ultrasonics Symposium since 1987 (Chair of Sensors, NDE, and Industrial Applications Group, 2004-2013), Associate Editor of the IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control since 1994, Lead Guest Editor for the IEEE Ultrasonics, Ferroelectrics and Frequency Control (UFFC) Special Issue on Ultrasonics and Ferroelectrics (August 2014), the IEEE UFFC Special Issue on Novel Embedded Systems for Ultrasonic Imaging and Signal Processing (July 2012), and the Special Issue on Advances in Acoustic Sensing, Imaging, and Signal Processing published in the Journal of Advances in Acoustics and Vibration (2013).

Dr. Saniie was the General Chair for the 2014 IEEE Ultrasonics Symposium in Chicago. He has served as the IEEE UFFC Ultrasonics Awards Chair since 2018. He also served as the Ultrasonics Vice President of the IEEE UFFC Society (2014-2017).

Publications

Saniie has over 350 publications in technical journals, conference proceedings, book chapters, and technical reports. To access his publications and research projects, please visit his research website (ECASP Research Laboratory).

Expertise

Ultrasonic signal and image processing, ultrasonic software-defined communication, artificial intelligence and machine learning, statistical pattern recognition, estimation and detection, data compression, time-frequency analysis, embedded digital systems, system-on-chip hardware/software co-design, Internet of Things, computer vision, deep learning, and ultrasonic nondestructive testing and imaging.